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Copper Plating Process - List of Manufacturers, Suppliers, Companies and Products

Copper Plating Process Product List

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High connectivity reliability electroless copper plating process with excellent follow-up characteristics.

High connectivity reliability electroless copper plating process with excellent follow-up characteristics.

Introducing the latest surface treatments for semiconductor package substrates all at once. We propose surface treatments and plating chemicals that support the miniaturization, high density, and high performance of electronic devices!

Electronic devices such as computers and smartphones are evolving daily. Along with this, multilayer printed circuit boards are also required to be miniaturized and made more densely packed. Our company has newly developed an electroless copper plating process that excels in coverage for the subtractive process using copper-clad laminates for printed circuit board manufacturing. Okuno Pharmaceutical Industry offers a wide variety of processing chemicals primarily for the plating process of printed wiring boards, covering all aspects of wet processes. Additionally, we propose the latest products and processes for the manufacturing processes of IC substrates and interposers produced by semi-additive processes, so please feel free to contact us.

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Non-dye-based copper sulfate plating process "Plymouth EX Series"

Non-dye-based copper sulfate plating process "Plymouth EX Series"

Compared to the dye-based copper sulfate plating process, the defect rate has been significantly reduced, resulting in substantial cost savings!

The "Plymouth EX Series" is a non-dye copper sulfate plating process developed by the German company Dr. Hesse (DR.HESSE). Compared to the currently mainstream dye-based copper sulfate plating processes, it significantly reduces the defect rate and contributes to substantial cost savings. We offer "Plymouth EX620-DC," which has leveling characteristics comparable to dye-based systems, and "Plymouth EX-201," which has very high resistance to scorching and excessive additives. 【Features】 ■ Reduction in cooling costs: No issues at a liquid temperature condition of -37°C ■ Reduction in production costs: Applicable with minimal air agitation or mechanical agitation ■ Reduction in defect rates: Relief from pits (bores) and edge buildup ■ Dramatic decrease in frequency of activated carbon replacement filtration: Fewer production downtime days per year, increasing operational days *For more details, please refer to the PDF document or feel free to contact us.

  • paint
  • Coating Agent

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Technological innovation to reduce transmission loss! Copper plating process on glass substrates.

Technological innovation to reduce transmission loss! Copper plating process on glass substrates.

Developed an electroless copper plating process that achieves high adhesion on glass substrates with low dielectric loss!

Glass has high smoothness and insulation properties, making it excellent for signal transmission characteristics, and it is gaining attention as an interposer material necessary for 2.5D implementation in semiconductor packaging. Various methods for forming adhesion layers, such as sputtering and sol-gel methods, have been researched to improve adhesion to glass materials. Our company has developed an electroless copper plating process called "PLOPX," which achieves high plating adhesion to glass substrates by using metal oxides deposited via Liquid Phase Deposition (LPD) as the adhesion layer. This process allows for all steps to be treated using wet methods.

  • Surface treatment contract service

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Electroless copper plating process for glass substrates for TGV surface treatment

Electroless copper plating process for glass substrates for TGV surface treatment

In collaboration with Panasonic Environmental Engineering Co., Ltd., we have newly developed an electroless copper plating process called "PLOPX" that achieves high adhesion on glass substrates!

Glass has high smoothness and insulation properties, making it excellent in signal transmission characteristics and attracting attention as an interposer material necessary for 2.5D implementation in semiconductor packaging. Various adhesion layers have been researched for improving adhesion to glass materials, including sputtering methods and sol-gel methods. Our company has developed an electroless copper plating process called "PLOPX," which achieves high plating adhesion to glass substrates by using metal oxides deposited via Liquid Phase Deposition (LPD) as the adhesion layer. This process allows all steps to be treated using wet methods.

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High connection reliability electroless copper plating process for semiconductor package substrates

High connection reliability electroless copper plating process for semiconductor package substrates

Ensuring crystal continuity at the interface between the inner copper layer and the upper plating layer, achieving advanced reliable connectivity required by cutting-edge packages.

OPC FLET Copper is an electroless copper plating solution of the noncyanide Rochelle salt type, adapted for semi-additive processes. It excels in low film thickness and uniform deposition on material surfaces and within via holes, reducing circuit width narrowing during flash etching. Additionally, it suppresses deposition on copper surfaces, achieving continuity of crystals between inner layer copper and upper layer plated copper, making it an ideal plating solution for fine pattern and micro via hole formation in IC substrates. 【Features】 - Excellent connection reliability between upper layer plated copper and inner layer copper - Achieves low film thickness with uniform and stable deposition on material surfaces and via hole walls - Suppresses blister formation on low roughness materials, providing excellent peel strength - The film demonstrates high purity and low resistance values, not hindering subsequent pattern plating even at low film thickness

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Electroless copper plating process for liquid crystal polymers (LCP)

Electroless copper plating process for liquid crystal polymers (LCP)

Developed a process that combines surface modification and plating to ensure high adhesion for liquid crystal polymers (LCP), known as the top LECS process.

Since 2020, following 4G, 5G mobile communication services have also started in Japan. 5G not only enables ultra-high-speed communication but also features ultra-low latency that allows for smooth operation of robots and other devices in remote locations, as well as the ability to connect multiple smartphones and computers simultaneously. Currently, high-frequency compatible substrates using low-dielectric materials such as LCP and fluorine-based resins are attracting attention as suitable materials for high-speed transmission. In particular, liquid crystal polymer (LCP) excels in electrical properties in the high-frequency range, has a low moisture absorption rate, and offers excellent dimensional stability, leading to its increasing adoption for 5G and millimeter-wave applications. Our company has developed a process that combines surface modification and plating to ensure high adhesion for LCP, which is said to have difficulty securing copper plating adhesion.

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Non-electrolytic copper plating process "OPC SUBLET process"

Non-electrolytic copper plating process "OPC SUBLET process"

Electroless copper plating process "OPC SUBLET process" that achieves high connection reliability.

In recent years, the application environment for printed circuit boards has expanded, particularly in fields related to electric vehicles and autonomous driving, where there is a strong demand for improved reliability of interlayer connections, heat resistance, and durability. Additionally, in response to environmental regulations such as the RoHS directive, there is a consideration to switch the solder used in assembly from low-melting-point Sn-Pb solder (melting point 183°C) to high-melting-point solders such as Sn-Ag (melting point approximately 220°C). Therefore, our company has newly developed an electroless copper plating process that can maintain connection reliability even under severe conditions such as high temperature and high pressure.

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